Process Integration Intern in Boise, ID

Department Introduction

Micron's Wafer Level Packaging Technologies Team develops advanced interconnect and packaging solutions for next-generation memory technologies. Based in Boise, Idaho, the team works across engineering disciplines to define technology requirements, build program plans, and drive process integration innovation.

Position Overview

As an Advanced Package TD Process Integration Intern, you will work alongside experienced engineers on sophisticated interconnect technologies. The internship provides hands-on experience in problem-solving, experimental design, line monitoring, and data analysis, with a direct impact on yield improvement and process optimization.

Responsibilities

• Lead problem-solving activities using structured methods such as Kepner-Tregoe (KT)
• Define and implement Design of Experiments (DoE) for process development
• Communicate findings to local and global teams and present results to partners
• Support line monitoring through project management and yield improvement initiatives
• Develop new line monitoring methods and define critical metrics
• Conduct experimental work using Micron systems and document outcomes
• Analyze experimental results and provide clear, actionable recommendations
• Use AI tools, workflows and agents to maximize learning

Benefits

Micron offers medical, dental and vision plans in all locations, income protection benefits for illness or injury, paid family leave, a paid time-off program and paid holidays. Details are available in the Benefits Guide at micron.com/careers/benefits.