Intern, Process Integration

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in memory and storage solutions that turn information into intelligence, helping the world learn, communicate and advance faster than ever.

Micron's Wafer Level Packaging Technologies Team develops advanced interconnect and packaging solutions for next-generation memory. Based in Boise, Idaho, the team works across engineering disciplines to define technology requirements, build program plans, and drive process integration innovation.

As an Advanced Package TD Process Integration Intern, you will work alongside experienced engineers to support the development of advanced interconnect technologies. The internship offers hands-on experience in problem-solving, experimental design, line monitoring, and data analysis, contributing directly to yield improvement and process optimization.

Responsibilities

• Lead problem-solving activities using structured methods such as Kepner-Tregoe (KT)
• Define and implement Design of Experiments (DoE) for process development
• Communicate findings across local and global teams and present results to partners
• Support line monitoring through project management and yield improvement initiatives
• Develop new line monitoring methods and define critical metrics
• Conduct experimental work using Micron systems and document outcomes
• Analyze experimental results and provide clear, actionable recommendations
• Use AI tools, workflows and agents to maximize learning

Minimum Qualifications

• Currently pursuing a Bachelor's or Master's degree with an expected graduation no earlier than Fall 2027
• Strong data extraction, analysis, and reporting skills (e.g., JMP, system analytics)
• Strong collaboration and communication skills across multi-functional teams
• Ability to prioritize multiple complex tasks and adapt to changing responsibilities
• Initiative and flexibility to take on added responsibilities
• Tenacity to work under tight timelines and limited resources

Preferred Qualifications

• Experience with semiconductor process integration or packaging technologies
• Familiarity with structured problem-solving and decision-making frameworks
• Exposure to experimental design and statistical analysis tools
• Interest in advanced packaging and interconnect development

Micron offers medical, dental and vision plans in all locations, income protection programs, paid family leave, paid time off and paid holidays. Details are in the Benefits Guide at micron.com/careers/benefits.

Micron is an equal opportunity and affirmative action employer. All qualified applicants receive consideration without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other protected factor.

Micron prohibits child labor and complies with applicable labor laws and standards. Micron does not charge candidates recruitment fees.

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