Advanced Packaging TD Intern in Boise, ID

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in memory and storage solutions that turn information into intelligence, helping the world learn, communicate and advance faster than ever.

Join Micron's Advanced Packaging Technology Development (TD) team, where innovation and precision come together to build next-generation interconnect technologies. The team works on solutions that improve semiconductor performance, reliability and advanced packaging capabilities.

As an Advanced Package TD Process Intern, you will work alongside experienced engineers on technologies such as hybrid bonding, micro bump technology, Through-Silicon Vias (TSV) and thermal management. You will build hands-on experience in structured problem-solving, line monitoring, data analysis, experimental design and project management while contributing to process optimization and yield improvement. You will also use AI and Code Assist to build Agent-based solutions that support engineering analysis and process development.

Responsibilities

• Lead structured problem-solving activities, using methods such as Kepner-Tregoe (KT), to address process and yield challenges.
• Define, complete and analyze Design of Experiments (DoE) for advanced packaging and interconnect process development.
• Analyze process, line-monitoring and yield data, and develop new monitoring methods and critical metrics to support process optimization.
• Present technical findings and collaborate with engineering teams across sites and functional areas.
• Apply AI and Code Assist to build Agent-based solutions that improve data analysis, engineering workflows or process monitoring.