Mechanical Engineering Internship

About Qualcomm

Qualcomm relentlessly innovates, transforming businesses, enriching lives, and fortifying societies. Our solutions are pivotal in crafting a smarter, interconnected world. Building on our nearly 40-year history of era-defining technology breakthroughs, we deliver leading-edge AI, high-performance, lower-power computing, and unrivaled connectivity. We are proud to be the partner of choice to many of the world's largest enterprises. Together with our ecosystem partners, we enable next-generation digital transformation. At Qualcomm, we are engineering human progress.

Join Us in Shaping the Future

At Qualcomm, we are committed to engineering human progress by delivering intelligent computing everywhere. We are passionate about harnessing the power of technology to transform industries and improve lives. Our early career programs offer limitless opportunities for growth, mentorship, and meaningful work. By joining our team, you will be part of a community that is pushing the boundaries of what is possible in AI, computing, and connectivity. With a global footprint spanning over 30 countries, you will have the chance to collaborate with diverse talent and contribute to projects that are shaping the future of technology.

Our early career programs are designed to attract inventive minds, offering a platform to contribute to our long-term innovation pipeline. You will be part of a community that values collaboration, creativity, and continuous learning. Our programs provide real-world experience, technical skills, and professional development opportunities, empowering you to make a meaningful impact and achieve your career goals. Join us for our U.S. 2027 summer intern class!

Role Overview

As a Qualcomm Mechanical Engineering Intern, you will have the opportunity to push the boundaries of what exists and help establish new standards for tomorrow. You will work as an equal contributor on a team of leading engineers to design, simulate, and test mechanical and thermal systems that support Qualcomm's advanced semiconductor technologies. Projects may span IC packaging, chip/package co-design, thermal modeling, signal and power integrity, and next-generation cooling solutions.

This internship supports the Mechanical Engineering track. Based on your resume, you will be aligned to projects within this track.

Minimum Qualifications

• Currently enrolled in a bachelor's, master's, or Ph.D. degree program in mechanical engineering, materials science, or a related field
• Must be available for 11-14 weeks during Summer 2027 (May-September)
• Expected graduation date of November 2027 or later
• 1+ years of academic experience with programming languages such as Python, Matlab

Preferred Qualifications

• Candidates actively pursuing a degree with an anticipated graduation between November 2027 and June 2028
• Familiarity with Cadence Sip, AutoCAD, and Solidworks
• Coursework in Solid Mechanics, Mechanics of Materials, and Finite Element Analysis (FEA)
• Knowledge of IC packaging structures, chip-package interaction, and electronic packaging processes
• Experience with thermal system design, modeling, and testing
• Understanding of heat transfer, mechanical design, and microelectronics
• Exposure to server product design, system impedance testing, fan performance measurement, and heatsink design methodology
• Experience with Computational Fluid Dynamics (CFD), wind tunnel, and/or airflow bench operation

Qualcomm's Internship Program

Our interns join world-class teams to help define and build what is next for mobility and the world. You will be paired with a mentor with visibility to your project and team, receive support from your manager, and have access to the entire Qualcomm employee community to ensure your success. To round out your summer internship, we host professional development workshops, social events, cross-functional speaker sessions, and an executive speaker series. In addition to competitive hourly pay and accrued vacation time, you will receive relocation coverage and furnished housing accommodations for the duration of your internship.

Internship opportunities may be available in the following locations, depending on team and project needs: Austin, Boulder, Boxborough, Bridgewater, Chandler, Irvine, New York City, Louisville, Raleigh, San Diego, Santa Clara, and Seattle.

Application Process

By applying here, you are expressing interest in one of our many 2027 Qualcomm Mechanical Engineering internships. It is important to note that this is not a job posting for a specific role. We will review resumes on an ongoing basis, and a recruiter may reach out to you.

Future Employment Considerations

This internship aligns to a potential role that is not eligible for Qualcomm immigration sponsorship.

Export Control Notice

This role may require an export license for candidates with citizenship in certain countries (see current country list below, subject to change). Qualcomm, like other companies, is experiencing significant delays in the export license process. Please be advised that if an export license is required, you may not be able to start work with Qualcomm until the license is granted, which may impact your ability to participate in the internship.

Countries requiring export: Armenia, Azerbaijan, Belarus, Burma (Myanmar), Cambodia, China, Cuba, Georgia, Hong Kong, Iran, Iraq, Kazakhstan, Kyrgyzstan, Laos, Libya, Macau, Moldova, Mongolia, Nicaragua, North Korea, Russia, Sudan, Syria, Tajikistan, Turkmenistan, Ukraine, Uzbekistan, Venezuela, Vietnam, and Yemen.