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Research Design Intern 2027 (Yorktown Heights)

IBMYorktown Heights, NYPosted 1 month ago

Pay
Not listed
The posting doesn't say
Type
Internship
Full time
Where
Yorktown Heights, NY
Experience
Students
None required
Apply by
Nov 28, 2026
Date from the posting

About the job

At IBM Research, we are the innovation engine of IBM, exploring what's next in computing and shaping the technologies the world will rely on tomorrow. From advancing AI and hybrid cloud to pioneering practical quantum computing, we anticipate challenges and unlock new opportunities for clients, partners, and society. Working in Research means joining a team that accelerates discovery at the intersection of high-performance computing, AI, quantum, and cloud. You'll collaborate with leading scientists, engineers, and visionaries to push boundaries and turn ideas into reality.

In this role, you will join a world-class team of engineers and researchers and contribute to the development of innovative integrated circuits implemented in deep submicron CMOS technologies. We focus on innovative circuit designs for a range of emerging applications such as AI acceleration, high-speed communications, and chiplet-based integration approaches, among others.

Responsibilities

  • Collaborate on architecture/system-level development, including analysis of trade-offs using system simulations and/or software, and analysis of measured data from existing/prior ICs.
  • Perform design and/or synthesis of digital and/or mixed-signal circuit building blocks to meet specifications.
  • Perform co-simulation and verification of designed circuits and sub-systems.
  • Support physical design/synthesis and post-layout verification.
  • Document design concepts, simulation, and verification results.

Required Skills and Experience

  • Experience with industry-standard IC-development tools such as Cadence.
  • Experience with design using deep sub-micron CMOS technologies.
  • Track record of success in completing complex mixed-signal and/or digital IC designs.
  • Ability to create and communicate technical ideas effectively.
  • Knowledge of AI-accelerator architectures.
  • Knowledge of chiplet-based system implementation approaches and their associated communication interfaces.
  • Applied knowledge of standard-cell digital design, custom digital design, and/or mixed-signal design for high-speed communications.
  • Knowledge of common programming languages such as Python.
  • Experience with hardware-software co-design.

Skills mentioned

  • Python
  • Digital Design
  • Cadence
  • CMOS
  • Mixed-Signal Design
  • AI Accelerator Architectures
  • Chiplet Integration
  • Hardware-Software Co-Design

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