Hardware Engineering Internship

About Qualcomm

Qualcomm relentlessly innovates, transforming businesses, enriching lives, and fortifying societies. Our solutions are pivotal in crafting a smarter, interconnected world. Building on our nearly 40-year history of era-defining technology breakthroughs, we deliver leading-edge AI, high-performance, lower-power computing, and unrivaled connectivity. We're proud to be the partner of choice to many of the world's largest enterprises.

Join Us in Shaping the Future

At Qualcomm, we're committed to engineering human progress by delivering intelligent computing everywhere. Our early career programs offer limitless opportunities for growth, mentorship, and meaningful work. With a global footprint spanning over 30 countries, you'll collaborate with diverse talent and contribute to projects shaping the future of technology.

Our early career programs are designed to attract inventive minds, offering a platform to contribute to our long-term innovation pipeline. You'll be part of a community that values collaboration, creativity, and continuous learning. Join us for our U.S. 2027 summer intern class!

Role Overview

As a Qualcomm Hardware Engineering Intern, you'll have the opportunity to push the boundaries of what exists and help establish new standards for tomorrow. You will leverage your electrical and/or computer engineering degree to work on one of the following multi-disciplinary teams: System (architecture, modeling, power, thermal, silicon profiling), Front-end Design (micro-architecture, modeling, RTL), Implementation (synthesis & timing constraints), Design-for-Test (DFT), Physical Design (place & route, CTS, timing closure), Pre-silicon Verification (DV), Emulation, Post-silicon Validation (VI), CAD, and GPU Design.

This internship supports multiple technical tracks, including:

• GPU Engineering
• CPU Engineering
• Digital Design / DV
• SoC Systems Engineering

Based on your resume, you may be aligned to one or more of these tracks. Please clearly indicate your track interest(s) in your resume, as this is the only way to communicate preferences during the recruiting process.

Minimum Qualifications

• Currently enrolled in a bachelor's, master's, or Ph.D. degree program in computer engineering, computer science, electrical engineering, or a related field
• Must be available for 11-14 weeks during Summer 2027 (May-September)
• Expected graduation date of November 2027 or later
• 1+ years of academic experience with programming languages such as C, C++, Python, Perl, Verilog, SystemVerilog

Preferred Qualifications

• Candidates actively pursuing a degree with an anticipated graduation between November 2027 and June 2028
• Currently enrolled in a Master's or PhD degree program in computer engineering, electrical engineering, or a related field

Track 1: GPU Engineering

• Engineering design and development in MSM SOC and chipset architecture
• ASIC implementation of image processing camera IP
• GPU pipeline validation (stimulus generators, checkers, monitors, drivers, models)
• Graphics power analysis & optimization (Vulkan)
• Familiarity with multimedia or communication technologies including audio/video codecs, camera, WLAN, LTE, and 5G
• Programming experience in C, Perl, Verilog, SystemVerilog, C++, Python

Track 2: CPU Engineering

• Validation of CPU and SOC-level micro-architecture concepts
• Development of test and coverage plans, verification methodology, and scalable environments
• Execution of verification plans including regression, debug, and bring-up
• Familiarity with simulators, coverage tools, waveform viewers
• Programming experience in C, C++, Python

Track 3: Digital Design / DV

• RTL development for modem physical and MAC layer processing
• Verification component development using SystemVerilog and UVM
• Modeling cellular modem datapaths for bit-exact correctness
• Knowledge of digital design, DSP, wireless communication, LTE, 5G, Wi-Fi
• Exposure to machine learning concepts as applied to digital signal processing or modem architecture is a plus
• Programming experience in C, Python, Perl, Verilog, SystemVerilog, C++, Matlab

Track 4: SoC Systems Engineering

• Concepts in computer architecture (CPU, GPU, DSP, interconnects, MMUs, etc.)
• System-level performance modeling and simulation
• Power and thermal management strategies
• Post-silicon validation and characterization
• Embedded software design, driver development for Linux/Windows
• OS principles and HW/SW interaction
• Experience supporting or optimizing machine learning workloads on embedded systems or accelerators
• Understanding of power/performance tradeoffs and system-level architecture
• Programming experience in C/C++, Python; scripting and profiling tools

Qualcomm's Internship Program

Our interns join world-class teams to help define and build what is next for mobility and the world. You'll be paired with a mentor, receive support from your manager, and have access to the entire Qualcomm employee community. We host professional development workshops, social events, cross-functional speaker sessions, and an executive speaker series. In addition to competitive hourly pay and accrued vacation time, you will receive relocation coverage and furnished housing accommodations for the duration of your internship.

Application Process

By applying here, you are expressing interest in one of our many 2027 Qualcomm Hardware Engineering internships. This is not a job posting for a specific role. We will review resumes on an ongoing basis, and a recruiter may reach out to you.

Future Employment Considerations

This internship aligns to a potential role that is not eligible for Qualcomm immigration sponsorship.

Export Control Notice

This role may require an export license for candidates with citizenship in certain countries. Qualcomm is experiencing significant delays in the export license process. If an export license is required, you may not be able to start work until the license is granted, which may impact your ability to participate in the internship.