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HBM System Engineering Intern

MicronBoise, IDPosted 11 hours ago

Pay
$58k – $70k
per year
Type
Internship
Full time
Where
Boise, ID
Who
Bachelor's or Master's
Students
Apply by
Dec 3, 2026
Date from the posting

Job Description

As a High Bandwidth Memory (HBM) Product & System Engineering Intern, you will help validate and optimize Micron's HBM products, which are the fastest and highest-capacity HBM available. You will work alongside experienced engineers to build solutions for testing and integrating HBM into customer platforms, supporting generative AI and high-performance computing.

Responsibilities

  • Develop and improve software and hardware to validate HBM in various systems.
  • Configure, maintain, and characterize HBM-based systems in a lab environment.
  • Help debug complex technical challenges across hardware and software.
  • Share results and insights with teammates and leadership.
  • Learn and apply knowledge of HBM, DRAM, and memory systems.

Micron offers medical, dental and vision plans in all locations, income protection benefits, paid family leave, a paid time-off program and paid holidays. The full Benefits Guide is available at micron.com/careers/benefits.

Micron is an equal opportunity and affirmative action employer. All qualified applicants receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other protected factor under applicable law.

Skills mentioned

  • Python
  • Linux
  • Verilog
  • SystemVerilog
  • C/C++
  • FPGA

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