Intern - Process Pathfinding, DRAM Dry Etch

About the Role

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

At Micron, the Process Pathfinding organization develops next-generation semiconductor memory technologies and innovative device architectures. The team focuses on advancing process technologies that enable future memory products through fundamental research, process integration, and collaboration across engineering fields. This is an outstanding opportunity to contribute to innovative semiconductor development in a fast-paced, knowledge-focused environment.

As a DRAM Dry Etch Process Pathfinding Intern, you will support the development of advanced plasma etch processes for emerging memory technologies. Working alongside experienced engineers and multi-functional partners, you will gain hands-on experience with dry etch equipment, semiconductor process development, materials characterization, and data-driven problem solving. This role provides exposure to advanced manufacturing environments while contributing to process solutions that improve device performance and reliability.

Responsibilities

• Conduct experiments and fundamental research to develop innovative dry etch solutions for next-generation memory technologies.
• Partner with the Pathfinding team to develop and optimize dry etch processes that meet physical and electrical performance requirements.
• Apply analytical, statistical, and problem-solving methods to evaluate process performance, hardware capability, and process capability, and aid in resolving problems.
• Demonstrate a Safety First approach in all laboratory, fabrication, and collaborative work environments while effectively communicating technical results and recommendations.
• Leverage AI and digital tools to accelerate data analysis, technical learning, documentation, and process development activities.

Minimum Qualifications

• Currently pursuing a Master's or PhD degree in Materials Science, Physics, Chemistry, Chemical Engineering, or a related technical field; exceptional undergraduate candidates may be considered.
• Graduation date after September 2027.
• Academic or practical experience in vacuum systems, RF/plasma science, chemistry, or semiconductor processing equipment.
• Demonstrated ability to analyze technical data and communicate findings through written reports or presentations.

Preferred Qualifications

• Experience with semiconductor manufacturing, plasma etch processes, thin films, materials characterization, or related research.
• Strong interpersonal and collaboration skills demonstrated through academic, laboratory, or project-based work.
• Ability to work independently, manage priorities, and deliver results in a research or engineering environment.
• Proficiency with data analysis tools, statistical methods, and digital technologies used to support engineering decisions.
• Experience using AI-Assisted tools, Artificial Intelligence applications, or data-driven technologies to improve technical analysis, productivity, and learning.