Intern - HBM Design Development Technical Leadership

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The High Bandwidth Memory (HBM) organization develops industry-leading memory solutions that power artificial intelligence, high-performance computing, graphics, and data center applications. The team brings together experts across architecture, design, verification, physical design, product engineering, and validation to deliver advanced memory products that enable the world's most demanding computing workloads.

As an HBM Design Development Technical Leadership (DDTL) Intern, you will support the planning, execution, and coordination of next-generation HBM product development programs. You will work closely with technical leaders and engineering teams to track project execution, manage risks, analyze program data, and improve engineering productivity through automation, analytics, and AI-enabled workflows. This role offers exposure to both the technical and leadership aspects of semiconductor product development.

Responsibilities

• Support HBM product execution by tracking schedules, achievements, dependencies, technical risks, and design readiness throughout the development lifecycle.
• Collaborate with multi-functional engineering teams to monitor project status, coordinate deliverables, and support successful achievement completion.
• Develop dashboards, reports, data analytics solutions, and executive summaries to provide transparency into program health and key performance indicators.
• Create automation tools, workflow improvements, and AI-assisted solutions that improve engineering productivity, decision-making, and execution efficiency.
• Analyze project and engineering data to identify trends, risks, bottlenecks, and opportunities for continuous improvement.

Minimum Qualifications

• 0-2 years of relevant experience through internships, research projects, academic projects, leadership activities, or engineering experience related to semiconductors, hardware development, project management, or technical program execution.
• Currently pursuing a Bachelor's, Master's, or PhD degree in Electrical Engineering, Computer Engineering, Computer Science, Engineering Management, or a related technical field.
• Strong analytical, organizational, problem-solving, and communication skills.
• Basic understanding of semiconductor, hardware, system development, or engineering project lifecycles.
• Experience with spreadsheets, presentation software, data analysis, and reporting tools.
• Programming or scripting experience using Python, C/C++, Tcl, Perl, or similar languages.
• Ability to manage multiple priorities and collaborate effectively across diverse technical teams.
• Demonstrated experience or interest in using AI-enabled tools and large language models (LLMs) such as Copilot, Claude, ChatGPT, or similar technologies to improve productivity, technical analysis, and decision-making.

Preferred Qualifications

• Knowledge of memory technologies and semiconductor development, including DRAM, DDR, LPDDR, HBM, ASIC, FPGA, or SoC architectures.
• Exposure to RTL design, verification, physical design, timing analysis, CAD flows, silicon validation, or related semiconductor development processes.
• Experience developing automation tools, dashboards, workflow solutions, or data visualization applications using Python or similar technologies.
• Familiarity with Linux/Unix environments and semiconductor engineering methodologies.
• Experience applying AI-assisted solutions to automate tasks, analyze technical data, generate insights, or improve engineering workflows.
• Previous internship, research, leadership, or project experience involving complex technical programs or semiconductor development.
• Demonstrated interest in technical leadership, engineering management, product development, or cross-functional program execution.