Equipment Engineering Intern

Job Summary

This is a summer engineering internship at NXP's ATMC wafer manufacturing facility, lasting approximately 12 weeks. You will learn the basics of semiconductor manufacturing, technology, and operations, working alongside an experienced engineer mentor to troubleshoot production equipment and process issues within the factory.

You will drive one or more real projects urgently needed by the fab, focusing on key business metrics such as Safety, Quality, Delivery, and Cost. By the end of the internship, you will deliver tangible results to the business and present your findings to factory senior management.

Equipment engineering focuses on optimizing multi-million dollar production equipment, including parts, preventative maintenance, cleaning, and repair. Process engineering focuses on optimizing the processes (materials, time, temperature, dose, etc.) of various manufacturing steps.

Key Challenges

• Integrating tool improvements across multiple tool types with different operating systems.
• Coordinating multiple activities with shared or limited resources.

Cross-Functional Aspects

Collaborate with cross-functional teams (Process Engineers, Equipment Engineers, Operations, Facilities, etc.) to accomplish testing, improve tool performance, and manage tool installs, removals, and moves.

Job Qualifications

• Must be currently working towards a BS in Engineering (Mechanical, Materials Science, Chemical, or Electrical Engineering preferred).
• A desire to learn about the semiconductor industry.
• Strong verbal and written communication skills.
• Good problem-solving skills.
• Self-motivated; able to take initiative and work with a mentor.
• Excellent interpersonal skills.

To be considered for a summer internship with NXP, you must be returning to school or graduating at the conclusion of the internship term. If you are graduating prior to July 2027, please apply to Entry Level full-time roles.