Embedded Firmware Intern

Leidos Defense Systems is seeking a talented Embedded Design Engineering Intern to join a diverse team creating unique solutions for complex problems. With offices across the United States, we provide responsive, cost-effective engineering, scientific, and IT solutions in the defense, space, cyber, and commercial fields. The ideal candidate will thrive in a learning environment that encourages leadership and technical growth.

At Leidos, our mission is to reach, equip, and teach students with an interest in defense and aerospace. Running for over two decades, our internship program gives interns hands-on experience in their future career path. With no shortage of work, interning with Leidos promises growth, experience, and unrivaled opportunity across the US.

This position is in the Electrical Systems Department. The selected candidate will have the opportunity to experience and learn about all phases of the product life cycle, from concept development and detailed design through manufacturing, integration, testing, and post-delivery support. Additional learning opportunities related to digital-signal processing (DSP) design, printed circuit board (PCB) design, technical trade studies, and evaluation of technology improvements will be provided.

Primary Responsibilities

• Designing embedded software and firmware
• Performing HDL simulations and software unit tests
• Hands-on laboratory testing with instrumentation, test equipment, and debug/test methods
• Performing in a collaborative engineering environment working closely with multi-disciplinary teams
• Working with platforms such as FPGAs, microcontrollers, microprocessors, and mixed signal designs

Basic Qualifications

• Currently enrolled in an accredited college/university and working towards a degree in Computer Engineering or a related field
• Experience with C, C++, or Rust embedded software programming through course work, lab projects, and previous internships
• Demonstrates problem solving, teamwork, and communication skills
• Holds a GPA of 3.0 or higher
• Includes resume and unofficial transcripts in application
• Must be a US Citizen and be able to obtain and maintain a DoD Secret security clearance

Preferred Qualifications

Preference shown to candidates who have experience and/or working knowledge of:

• Utilizing modern Xilinx FPGA and SoC families and design tools (RFSoC, Xilinx IP Cores, AXI4, AXI-Stream)
• Basic knowledge of FPGA/Firmware languages (VHDL, Verilog, SystemVerilog, assembly, Rust)
• Experience with simulation and test frameworks
• RISC microprocessor architectures (ARM Cortex, Microblaze, PowerPC, RISC-V)
• Memory architectures, types, and caching
• GNU/Linux and developing kernel drivers
• Communication protocols such as UART, Ethernet, SPI, I2C, CAN bus, etc.
• Embedded operating systems (Linux, VxWorks, Integrity, FreeRTOS, Zephyr, uC/OS-II)
• Electronics and PCBA design
• Leading design teams including technical leadership, budgeting, and scheduling

If you're looking for comfort, keep scrolling. At Leidos, we outthink, outbuild, and outpace the status quo, because the mission demands it. We're not hiring followers. We're recruiting the ones who disrupt, provoke, and refuse to fail. Step 10 is ancient history. We're already at step 30, and moving faster than anyone else dares.